With almost two decades of Product Research & Development, Hollyland(China) Electronics Technology Coporation Limited accumulates extensive experiences and core technology in processing the Fuse Element, selection in Encapsulation and Fillings for achieving various Electrical Performance Characteristics.

Our Research & Development capability also allows us offering Miniature Fuse much smaller in size but of similar capacity.

In recent years, our Company successfully developed Surface Mounted Device Chip Fuse and acquired the Polymer Positive Temperature Coefficient Device technology. These technologies compliment our traditional offer of glass-tube, ceramic-tube, radial lead and microfuse.

HCET has entered partnership with famous Universities and Design Institutes for research & development on new generation materials and product performance enhancements.

Our Company is equipped with in-house testing facilities and analytical devices for Physical, Environmental, Electrical and Performance Tests for both Electronics Fuse and PPTC Device.